Why QIF Matters: A Road Map for Digital Manufacturing



By
DMSC
27 March 19
0
comment
Why QIF Matters: Digital Manufacturing Road Map

How the ANSI/DMSC Quality Information Framework (QIF) standard provides benefit to the Model-Based Enterprise (MBE) will be presented by Curtis Brown, President of the DMSC and a panel of experts at the 2019 MBE Summit.

QIF standard benefits MBE in two important ways: (1) automation of cyber-physical processes, allowing faster realization of higher quality products at lower cost, and (2) by providing traceability of massive quantities of measurement-related data to the authority product definition model. Over the last decade, efforts have been made to develop digital interoperability standards that address the connection points for information transfer through the product lifecycle. Through early work in the Automotive Industry Action Group (AIAG) and the Digital Metrology Standards Consortium (DMSC), new data models have emerged and achieved significant maturity levels.

Presentation:  April 3rd, Session #16-B @ 15:35

The benefits of automation and business process systemization are made possible with meaningful, semantic data packaged in the QIF format. With Model-Based Definition (MBD) data (i.e., PMI, FT&A, etc.) becoming more commonplace, QIF is becoming an attractive complete and unambiguous MBD delivery mechanism for industrial end users. In addition to automation benefits, QIF helps to provide data traceability in this age of Big Data, where traceability is sorely needed. MBE provides a paradigm for organizing this data by mapping it all to a meaningful product definition: the master model-based definition enabled by a product data management system. QIF is designed to instantiate this MBE approach to data management.

This paper will explain the background for why QIF is needed, and the features built into QIF which will ensure that it is equipped to handle the needs of modern industry.

The QIF 3.0 standard is available for free download now.

Joining Curtis Brown on the panel will be:
Daniel Campbell (Capvidia, United States)
Curtis Brown (Honeywell FM&T, United States)
Jennifer Herron (Action Engineering, United States)
Robert Brown (Mitutoyo America Corporation, United States)
John Horst (NIST, United States)
Ray Admire (QIF Solutions, United States)