The 2019 QIF Summit was held in conjunction with the 3D Collaboration and Interchangeability Congress (3D CIC) event in Golden, CO. The 3D CIC fosters concentrated conversations about CAD-agnostic digital methods for Model-Based Enterprise advancement. As an active promoter of QIF standards, DMSC teamed with Action Engineering to sponsor the joint program, focused on CAD collaboration and data interoperability for the entire product lifecycle.
Included in the program were multiple case study presentations showing QIF implementations and the associated ROI for such approaches, even in the preliminary phase of product development. Corporate presentations included Cisco, Stryker, GE Appliances and the Manufacturing Technology Center (MTC), a UK government initiative that specializes in digital manufacturing, additive manufacturing, robotics,and intelligent automation.
The event was held October 12-15, 2019, and included nearly 200 participants. The QIF Summit is held every-other-year, with the next event currently scheduled for 2021.