The upcoming 3D CIC (Collaboration Interoperability Congress) event will have plenty of “DMSC flavor” with numerous DMSC members making presentations. The 3D CIC brings together industry leaders, cross-functional engineers, and 3D data practitioners as well as stakeholders who collaborate with or support these areas. 3D CIC strongly emphasizes the interoperability and social science aspects of whole enterprise success.
Planned presentations from DMSC members:
Curtis Brown | Honeywell FM&T:
Next Generation Digital Product Realization Process
Rosemary Astheimer | NIST:
STEP by Step to MBD
Tom Groff and Alex Garvey | KOTEM:
Navigating the Perils: Unstandardized GD&T in MBD
Jennifer Herron | Action Engineering:
Creating Better Foundations for the Digital Twin
Scott Hutcheson | Purdue University:
The Hipster, the Hustler, and the Hacker:
Your Talent Trifecta for Transformation
Jan de Nijs | Lockheed Martin:
Enabling Advanced Analytics Use Cases
that Require Manufacturing Data
Jacob Sherwood | Pratt & Whitney:
Feature and Characteristic Accountability in the Digital Thread
Hermitt Vega | Pratt & Whitney:
Model-Based Mission/Quality Assurance (MBM/QA)
The 3D CIC will be held in Golden, CO on March 4 – 7, 2024.
DMSC is an event sponsor. About 3D CIC.
